MediaTek announces the launch of the Dimensity 9400e, a flagship mobile chipset built on TSMC’s advanced third-generation 4nm process, strengthening its position in the premium smartphone SoC market. The launch marks a strategic expansion of MediaTek’s high-end offerings, giving OEMs broader flexibility in delivering cutting-edge performance, energy efficiency, and AI capabilities in flagship devices.
The Dimensity 9400e introduces MediaTek’s “All Big Core” CPU architecture, integrating four Cortex-X4 super cores(up to 3.4GHz) and four Cortex-A720 big cores (2.0GHz), paired with a 12-core Immortalis-G720 GPU. This setup is engineered to meet the demands of AI computing, immersive gaming, and high-performance multitasking—all while maintaining impressive power efficiency.
“This launch expands our flagship Dimensity family to offer more differentiated premium experiences to our partners and users,” said Dr. Yenchi Lee, general manager of MediaTek’s Wireless Communications Business Unit. “With unmatched AI integration, connectivity, and graphics performance, we’re raising the bar for mobile computing.”
Aimed squarely at the upper tier of the mobile market, the Dimensity 9400e brings substantial commercial significance. It features hardware-level mobile ray tracing, MediaTek’s HyperEngine gaming suite, and real-time Adaptive Gaming Technology (MAGT 2.0). Combined with MediaTek’s latest Frame Rate Converter (MFRC 2.0+), the chip allows smoother, more power-efficient gaming—crucial for competitive differentiation in premium Android smartphones.
On the AI front, the chipset supports major language models like Gemini Nano, LLaVA-1.5 7B, and Qwen1.5B, enabling on-device generative AI experiences. This positions MediaTek as a formidable player in the race to localize AI workloads in consumer hardware.
Connectivity is another key differentiator. The 9400e offers Wi-Fi 7 tri-band concurrency, 5G sub-6GHz 4CC-CA with up to 7Gbps theoretical downloads, and Bluetooth range of up to 5km line-of-sight—technologies that appeal to both consumers and mobile operators seeking seamless, high-performance connectivity.
Flagship-grade imaging support is also front and center, with an 18-bit RAW ISP, semantic segmentation video engines, and triple-microphone HDR audio capture, catering to the growing demand for pro-level content creation on mobile devices.
The first smartphones powered by the Dimensity 9400e are expected to debut later this month, potentially challenging Qualcomm’s dominance in the ultra-premium chipset segment and giving device manufacturers more diverse flagship options.
