MediaTek has announced the successful tape-out of its next-generation flagship system-on-chip (SoC) using TSMC’s enhanced N2P 2nm process, becoming one of the first companies to do so. The chip is expected to enter volume production by late 2026.
This development marks a major milestone in MediaTek’s long-standing partnership with TSMC, and underscores both companies’ leadership in advanced semiconductor technologies. TSMC’s N2P process, the latest evolution in its 2nm technology family, builds on nanosheet transistor architecture to offer up to 18 percent higher performance at the same power, 36 percent lower power at the same speed, and 1.2x logic density compared to the current N3E process.
“This collaboration continues to deliver the highest levels of performance and power efficiency across mobile, computer, automotive, and data center applications,” said Joe Chen, president of MediaTek. TSMC’s Dr. Kevin Zhang highlighted N2P as a major leap forward in energy-efficient computing.
The new chip will bolster MediaTek’s offerings across edge-to-cloud devices, reinforcing its position as a global semiconductor leader powering over 2 billion connected devices annually.
